Industry-approved techniques on through-hole and surface-mount technology (SMT) rework as well as land, conductor, and laminate repair. Covers procedural requirements, tools, materials, and methods for removing and replacing conformal coatings, surface-mount, and through-hole components. Also covers procedures for repairing and modifying boards and assemblies. Includes certification in the Institute of Printed Circuits (IPC) rework and repair standard IPC-7711C/7721C.